Qualcomm’s new chip ushers in the Wi-Fi 8 and Bluetooth 7 era

Wi-Fi 7 and Bluetooth 6 are just starting to become mainstream, but Qualcomm is already looking ahead to Wi-Fi 8 and Bluetooth 7 with its latest mobile connectivity chip. The company announced the Qualcomm FastConnect 8800 at MWC 2026 today, which is the first mobile offering to support Wi-Fi 8, Bluetooth 7, Ultra Wideband 802.15.4ab, and Thread 1.5 in the same chip. The Wi-Fi 8 era is officially upon us, with FastConnect 8800 products expected to launch later this year.

Qualcomm’s FastConnect 8800 connectivity chip is built using a 6nm process node and a new 4×4 radio configuration. Compared to the standard 2×2 radio configuration found on chips like the FastConnect 7900, the 4×4 layout debuting on the FastConnect 8800 makes double-digit throughput possible, according to the company. It enables peak speeds of up to 11.6 Gbps and up to three times the range of current FastConnect chips.

That’s double the speeds of the chip’s predecessor, although you are unlikely to see those figures in real-world situations — they are based on the maximum physical layer (PHY) rate of the chip. By incorporating Wi-Fi 8 technology, FastConnect 8800 can support new features like Extended Long Range (ELR).

Wi-Fi 8 upgrades are only part of the FastConnect 800 upgrades. The connectivity chip also supports Bluetooth 7 with Bluetooth High Data Throughput, raising speeds from 2 Mbps to 7.5 Mbps. There is compatibility with Qualcomm’s Expanded Personal Area Network (XPAN), Bluetooth LE Audio, and the Snapdragon Sound suite. That means you can use aptX Lossless, aptX Adaptive, aptX Voice on supported devices for high-resolution Bluetooth audio streaming.

Qualcomm says we can expect FastConnect and Dragonwing AI connectivity chips with Wi-Fi 8 to appear in consumer products starting in late 2026.